Research engineer/Post-doc position Development of Measurement & Simulation Platform For Innovative Logic 3D Circuit Design

Research engineer/Post-doc position

Development of Measurement & Simulation Platform

For Innovative Logic 3D Circuit Design

Context: Data size and functionality requirements for computing are increasing, according to the expectation that hardware performance will continue to improve, irrespective of the actual implementation. However, the end of conventional technological roadmap scaling is anticipated in just a few technology nodes, mainly for cost reasons (multiple patterning, EUV) down to the 7nm FinFET gate length node. In this context, vertical integration is a particularly attractive approach because of its intrinsic 3D nature. The vertical NW (nanowire) array based transistor is a viable option to circumvent both physical and design limitations while they are much easier to manufacture. Therefore, new 3D logic architectures are mandatory (ANR LEGO http://www.lego.cnrs.fr and H2020 PROACT FVLLMONTI https://cordis.europa.eu/project/id/101016776/fr).

Activity

To fill the gap between the device research and innovative 3D logic circuit design, the objectives are focused on:

• To demonstrate the viability of vertical NWFET technology at the logic circuit level
• To develop accurate physics-based compact models through on-wafer characterization of vertical NWFET technology
• To develop a full design kit containing compact models to support the circuit design process
• To assess the technology roadmap improvements and the associated logic performance metrics

Indeed, within the LEGO and FVLLMONTI projects, partners will handle the technological design of the device and innovative 3D logic blocks. IMS will develop the associated test structures and make the link with the PDK compact model. The here below job description will take place in the MODEL team which features long experience in both domains. Therefore, there is a strong team activity associated with the proposed position.

Job description

The candidate is required to work on different types of measurement and simulation using dedicated softwares and instruments:

• Electromagnetic simulations (Ansys HFSS and Keysight ADS-Momentum) to design and analyze dedicated de-embedding test structures
• Use of Vectorial Network Analyzer (VNA) for on-wafer measurements, involving probe-tip calibration and device S-parameter measurements (Keysight IC-CAP)
• SPICE/VerilogA simulation for compact model parameter extraction using on-wafer measurement data of vertical nanowire transistors
• Possible interfacing with physical simulation using ’’Device Simulation Tools’’ for physical and electro-thermal simulation of vertical nanowire structures (Global TCAD Solutions softwares)

Requested technical skills

The list below is priority-ordered:

1. Strong knowledge and proven experience in electromagnetic simulation and tools (HFSS, Momentum)
2. Strong knowledge in high frequency electronics and instrumentation (VNA, calibration, de-embedding)
3. Knowledge of SPICE/VerilogA device modeling/simulation
4. Knowledge of programming and scripting (ICCAP) for measurement and data acquisition
5. Knowledge of physics of semiconductor devices
6. Optionally skilled at physical simulation and ’’Device Simulation Tools’’ (Silvaco, Synopsys)

Requested soft skills

1. Management qualities for team and project organization
2. English language skills : Oral and written
3. Strong abilities to work in a team

Job details

The position will be held in University of Bordeaux, IMS Laboratory, within MODEL team.

The contract duration is one year, with 2-year extension (overall 3 years).

Proposed Net Monthly Salary 2 086,45 EUR - 2 304,88 EUR, depending on the candidate’s professional experience.

Contact: Prof. Cristell Maneux cristell.maneux@u-bordeaux.fr